US Patent Issued to SJ Semiconductor(Jiangyin) on March 24 for "Packaging structure and packaging method" (Chinese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,544, issued on March 24, was assigned to SJ Semiconductor(Jiangyin) Corp. (JiangSu Province, China).

"Packaging structure and packaging method" was invented by Yenheng Chen (Jiangyin City, China) and Chengchung Lin (Jiangyin City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging structure comprising a first antenna layer on a protective layer, a dielectric layer, a first plastic packaging layer over the first antenna layer, a second conductive pillar, a chip, a redistribution layer, and a second plastic packaging layer, the first conductive pillar is electrically connected to the first antenna layer, the dielectric layer is formed o...