US Patent Issued to SILTRONIC on Feb. 24 for "Method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes" (German Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,731, issued on Feb. 24, was assigned to SILTRONIC AG (Munich).

"Method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes" was invented by Georg Pietsch (Burghausen, Germany) and Peter Wiesner (Reut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Wafers are sliced from a workpiece using a wire saw during slicing operations. The wire saw has a wire web of sawing wire and a setting device. The wire web is stretched in a plane between wire guide rollers that are mounted between fixed and moveable bearings. During each of the slicing operations, the setting device feeds the workpiece thr...