ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,229, issued on Nov. 18, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Electronic package" was invented by Chih-Hsien Chiu (Taichung, Taiwan), Wen-Jung Tsai (Taichung, Taiwan) and Chi-Ching Ho (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the...