US Patent Issued to SILICONWARE PRECISION INDUSTRIES on March 31 for "Electronic package and substrate structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,694, issued on March 31, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).

"Electronic package and substrate structure thereof" was invented by Hsiu-Fang Chien (Taichung City, Taiwan), Wen-Chen Hsieh (Taichung City, Taiwan), Chia-Wen Tsao (Taichung City, Taiwan), Hsin-Yin Chang (Taichung City, Taiwan), Ya-Ting Chi (Taichung City, Taiwan) and Yi-Lin Tsai (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided and includes a substrate structure and an electronic element disposed on the substrate structure. The substrate structure is provided with a plurality of circuits ...