US Patent Issued to SILICONWARE PRECISION INDUSTRIES on March 31 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,698, issued on March 31, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Chia-Chu Lai (Taichung City, Taiwan), Yi-Min Fu (Taichung City, Taiwan) and Chien-Sheng Chen (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure with a circuit layer, a first encapsulating layer and a second encapsulating layer are formed on the carrier structure to cover the electronic element, a first antenna layer is f...