ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,986, issued on June 23, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).
"Electronic package and manufacturing method thereof" was invented by Chung-Chih Yen (Taichung City, Taiwan), Kuo-Hui Wan (Taichung City, Taiwan) and Chun-Chu Lai (Taichung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package and a manufacturing method thereof are provided, in which a groove space for accommodating an electronic element is formed on a wiring structure, and an encapsulation layer is formed on the wiring structure to cover the electronic element. Via the design of the groove space, the overall thickne...