US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Jan. 20 for "Electronic package and electronic structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,766, issued on Jan. 20, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and electronic structure thereof" was invented by Yung-Ta Li (Taichung, Taiwan) and Po-Kai Huang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided in which an electronic structure is bonded onto a carrier structure via a plurality of conductive elements, where each of the conductive elements is connected to a single contact of the electronic structure via a plurality of conductive pillars. Therefore, when one of the conductive pillars fails, each of the conductive elements can stil...