US Patent Issued to Silicon Mitus, Silicon-Magic Semiconductor Technology (Hangzhou) on Aug. 18 for "Wafer level chip scale package with rhombus shape" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,633, issued on Aug. 18, was assigned to Silicon Mitus Inc. (Seongnam-Si, South Korea) and Silicon-Magic Semiconductor Technology (Hangzhou) Co. Ltd. (Hangzhou, China).

"Wafer level chip scale package with rhombus shape" was invented by Ji Hoon Hong (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a wafer level chip scale package with a rhombus shape which includes a semiconductor chip with a rhombus shape and a solder ball array including a plurality of solder balls formed on one surface of the semiconductor chip. Among four interior angles of the semiconductor chip, two of the four interior angles...