US Patent Issued to Silergy Semiconductor Technology (Hangzhou) on Feb. 17 for "Lead frame, chip package structure, and manufacturing method thereof" (Chinese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,663, issued on Feb. 17, was assigned to Silergy Semiconductor Technology (Hangzhou) LTD (Hangzhou, China).

"Lead frame, chip package structure, and manufacturing method thereof" was invented by Shijie Chen (Hangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a lead frame can include: providing a frame base; providing a substrate to support the frame base; and selectively etching the frame base to form first and second type pins. The first type pins are distributed in the central area of the lead frame, and the second type of the pins are distributed in the edge area of the lead frame. The first type pins are separated ...