US Patent Issued to SIKA TECHNOLOGY on June 30 for "Thermally conductive curable composition" (Swiss, German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,698, issued on June 30, was assigned to SIKA TECHNOLOGY AG (Baar, Switzerland).

"Thermally conductive curable composition" was invented by Klaas Mennecke (Lottstetten, Germany), David Hofstetter (Winterthur, Switzerland) and Fabien Choffat (Ruttenen, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A moisture-curable composition, including between 0.6 and 15.0 wt.-% of at least one organic polymer containing reactive silane groups, between 70 and 95 wt.-% of at least one filler, at least one dispersion additive, optionally at least one catalyst for the curing of silane-functional polymers and up to 10 wt.-% of at least one plasticizer, cha...