US Patent Issued to Siemens on July 21 for "Arrangement for cooling a power module, and power module" (German Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,175, issued on July 21, was assigned to Siemens AG (Munich).

"Arrangement for cooling a power module, and power module" was invented by Bernd Roppelt (Unterhaid, Germany), Jens Schmenger (Forchheim, Germany), Thomas Schwinn (Herzogenaurach, Germany), Roman Kogler (Nuremberg, Germany) and Alexander Luft (Nuremberg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An arrangement for cooling a power module with at least one power unit in a housing is provide, the arrangement having at least one heat sink, in which the arrangement for cooling has at least one heat-sink cover, and at least a part of the power module, in particular the housing, at l...