US Patent Issued to Siemens Medical Solutions USA on June 23 for "Connection for a multi-dimensional matrix transducer" (Washington Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,088, issued on June 23, was assigned to Siemens Medical Solutions USA Inc. (Malvern, Pa.).

"Connection for a multi-dimensional matrix transducer" was invented by Baik Woo Lee (Issaquah, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "For transducers with a chip-on-array arrangement, the dematching layer extends beyond a footprint of the array, allowing for connection of the grounding plane without sidewall metalization. The flexible circuit material is tiled, reducing thermal deformation, reducing cost, and increasing process yield. The dematching layer extension and the tiled flexible circuit may be used together or individually in a given tra...