US Patent Issued to SHUNYUN TECHNOLOGY (ZHONGSHAN) on Sept. 22 for "400G silicon photonic package with self-aligned fiber" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,742,940, issued on Sept. 22, was assigned to SHUNYUN TECHNOLOGY (ZHONGSHAN) Ltd. (Zhongshan, China).

"400G silicon photonic package with self-aligned fiber" was invented by Mark Tieu Ming Seng (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 400G silicon photonic package with a self-aligned fiber includes a printed circuit board (PCB) base, a photonic integrated circuit (PIC) chip, a fiber array unit (FAU), and a distributed feedback (DFB) laser. The PIC chip is mounted on the PCB base; the DFB laser is provided on the PCB base and located outside the PIC chip; the FAU includes a fixed plate, a transmitting-terminal fiber, and a recei...