US Patent Issued to SHUNYUN TECHNOLOGY (ZHONGSHAN) on May 12 for "400G silicon photonic integrated optical module with embedded thermoelectric cooler (TEC) substrate" (Chinese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,625,334, issued on May 12, was assigned to SHUNYUN TECHNOLOGY (ZHONGSHAN) Ltd. (Zhongshan, China).

"400G silicon photonic integrated optical module with embedded thermoelectric cooler (TEC) substrate" was invented by Jie Huang (Zhongshan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate includes: a housing, a printed circuit board (PCB) substrate, and a silicon photonic integrated circuit board, where an accommodating cavity is formed in the housing; the PCB substrate is provided in the accommodating cavity; a TEC substrate is embedded into the PC...