ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,468, issued on March 17, was assigned to SHPP GLOBAL TECHNOLOGIES B.V. (Bergen op Zoom, Netherlands).
"Thermoplastic compositions and uses thereof" was invented by Wenhao Liu (Shanghai), You Jun Wu (Shanghai), Siguang Jiang (Shanghai) and Zheng Wang (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A composition includes particular amounts of a liquid crystalline polymer; a thermoplastic polymer including a polyetherimide, a polyarylate, or a poly(arylene ether-sulfone); and a compatibilizer including a polyepoxy compound or a poly(ester-carbonate). Methods for the manufacture of the compositions and articles including the composition are al...