ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,550, issued on Aug. 4, was assigned to SHOEI CHEMICAL INC. (Tokyo).
"Method for manufacturing electronic component" was invented by Soichiro Esaki (Tosu, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition cont...