US Patent Issued to SHOEI CHEMICAL on Aug. 18 for "Thermosetting conductive resin composition and method for producing electronic component" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,690, issued on Aug. 18, was assigned to SHOEI CHEMICAL INC. (Tokyo).

"Thermosetting conductive resin composition and method for producing electronic component" was invented by Shohei Araki (Tosu, Japan), Toshio Yoneima (Tosu, Japan) and Soichiro Esaki (Tosu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thermosetting conductive resin composition including: a conductive powder including a base metal; a thermosetting silicone resin having hydroxyl groups; and at least one of an amine-based additive and an acid-based additive. According to the present invention, a thermosetting conductive resin composition for forming electrodes of...