ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,962, issued on March 17, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Semiconductor device" was invented by Yoichi Nishihara (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a laminate including a semiconductor element, an insulating substrate on a first surface of the semiconductor element, an interconnect on the insulating substrate, and an interconnect member on a second surface of the semiconductor element. The interconnect is electrically connected to a first electrode in the first surface of the semiconductor element through a through hole in the insulating substrate. The i...