ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,936, issued on March 17, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Interconnect substrate" was invented by Yoko Nakabayashi (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect substrate includes alternately stacked pads and insulating layers, and via interconnects extending through respective ones of the insulating layers, the via interconnects and the pads being alternately stacked in a vertical direction, the pads being electrically connected to each other via the via interconnects, wherein the pads include a first pad disposed on an uppermost one of the insulating layers and electrically conn...