US Patent Issued to SHINKO ELECTRIC INDUSTRIES on June 30 for "Semiconductor device including semiconductor elements, insulating base members, wirings, and at least one wiring member" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,560, issued on June 30, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Semiconductor device including semiconductor elements, insulating base members, wirings, and at least one wiring member" was invented by Koji Bando (Nagano, Japan) and Kenichi Koi (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first semiconductor element; a second semiconductor element; a first insulating base member including a fifth face and a sixth face; a second insulating base member including a seventh face and an eighth face; a first wiring that penetrates through the first insulating base member, and...