US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Jan. 20 for "Header for semiconductor package, and semiconductor package" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,589, issued on Jan. 20, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Header for semiconductor package, and semiconductor package" was invented by Masao Kainuma (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A header for a semiconductor package, includes an eyelet having a through hole penetrating the eyelet from an upper surface to a lower surface of the eyelet, a first lead inserted inside the through hole, and an insulating substrate disposed on the upper surface of the eyelet, and provided with a first through hole at a position overlapping one end of the first lead in a plan view. The insulating substrate ...