US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Feb. 17 for "Circuit board, semiconductor device, and method of manufacturing circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,222, issued on Feb. 17, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Circuit board, semiconductor device, and method of manufacturing circuit board" was invented by Hikaru Tanaka (Nagano, Japan), Takahiko Kiso (Nagano, Japan) and Aya Mashima (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes an insulating layer that is layered on a substrate; and a dam member in a form of a rectangular frame that is formed on the insulating layer. A corner part of the dam member includes a slope that slopes down from an inner wall surface to a surface of the insulating layer in a lower part that makes cont...