US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Feb. 10 for "Interconnect substrate and method of making the same" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,762, issued on Feb. 10, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Interconnect substrate and method of making the same" was invented by Hikaru Tanaka (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect substrate includes a pad for external connection and an insulating layer, wherein part of a lower surface of the pad is covered with the insulating layer, wherein the pad is situated in a recess formed in an upper surface of the insulating layer, such that a groove is present between the pad and a perimeter of the recess around the pad in a plan view of the interconnect substrate, and wherein a bot...