ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,673, issued on Feb. 10, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Ceramic substrate, electrostatic chuck, substrate fixing device, and package for semiconductor device" was invented by Akira Goto (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A ceramic substrate includes a base body, and an electrical conductor pattern embedded in the base body. The base body is composed of ceramics. The electrical conductor pattern has, as a main component, a solid solution having a body-centered cubic lattice structure in which copper is solid-dissolved in tungsten."

The patent was filed on March 22, 2023, under Applicat...