US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Dec. 30 for "Wiring board, semiconductor device, and wiring board manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,829, issued on Dec. 30, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Wiring board, semiconductor device, and wiring board manufacturing method" was invented by Masayuki Mizuno (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a first wiring layer, an insulating layer that is arranged on the first wiring layer, and a second wiring layer that is arranged on the insulating layer. The first wiring layer includes a first plain layer, an opening that penetrates through the first plain layer, and a reinforcing pad that is arranged in the opening. The second wiring layer includes a second plain la...