US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Dec. 23 for "Semiconductor device including semiconductor elements, insulating base members, wirings, and wiring members" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,063, issued on Dec. 23, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Semiconductor device including semiconductor elements, insulating base members, wirings, and wiring members" was invented by Hitoshi Ito (Nagano, Japan) and Kenichi Koi (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first semiconductor element; a second semiconductor element; a first insulating base member adhesively bonded to the first semiconductor element; a first wiring connected to a first electrode of the first semiconductor element, and disposed on the first insulating base member; a second insulating...