ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,966, issued on Dec. 2, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Substrate fixing device" was invented by Masahiro Sunohara (Nagano, Japan) and Keita Sato (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate fixing device includes a base plate having a first through-hole penetrating through the base plate in a thickness direction of the base plate, a ceramic plate adhering to the base plate, having an electrode embedded in the ceramic plate and a second through-hole formed to communicate with the first through-hole, and configured to adsorb an adsorption target object by an electrostatic force that is ...