ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,247, issued on Sept. 8, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).
"Debris determination method" was invented by Tomohiro Saito (Takasaki, Japan) and Tatsuya Masuda (Takasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A debris determination method of determining, using an image obtained by an appearance inspection device, debris that occurs around a hard laser mark (HLM) on a backside of a wafer, including: a step of calculating reference luminance from a grayscale image obtained by the appearance inspection device; a step of extracting a printed region including the HLM from the grayscale image; a step of excluding a dot portio...