US Patent Issued to SHIN-ETSU HANDOTAI on Oct. 27 for "Packaging member for packaging object to be transported between clean rooms, packaging method, and transporting method" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,152, issued on Oct. 27, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).

"Packaging member for packaging object to be transported between clean rooms, packaging method, and transporting method" was invented by Seiji Satoh (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging member for packaging an object to be transported between clean rooms, the packaging member being used for packaging the object to be transported, being a FOUP or a FOSB, when transport thereof between the clean rooms each having a clean atmosphere of a semiconductor factory, in which the packaging member includes a dust-free cloth having dust-proof proper...