US Patent Issued to SHIN-ETSU HANDOTAI on Aug. 11 for "Polishing pad, double-side polishing device, and double-side polishing method for wafer" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,059, issued on Aug. 11, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).

"Polishing pad, double-side polishing device, and double-side polishing method for wafer" was invented by Junichi Ueno (Shirakawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein, the double-sided tape has a 90deg peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90deg peeling adhesive strength A to a 180deg peeling adhesive...