US Patent Issued to SHIN-ETSU CHEMICAL on Sept. 29 for "Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,748,350, issued on Sept. 29, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method" was invented by Hitoshi Maruyama (Annaka, Japan) and Kumiko Hayashi (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a photosensitive resin composition containing: (A) a silicone resin containing an acid-crosslinkable group; (B) an alicyclic epoxy compound represented by formula (B1) or (B2); and (C) a photo-acid-generating agent.(In the formula, R11 through R46 are each independently a hydrogen atom or a C1-8 saturated hydrocarbyl ...