ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,535, issued on Sept. 15, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).
"Heat-curable bismaleimide resin composition" was invented by Masayuki Iwasaki (Annaka, Japan), Yoshihiro Tsutsumi (Annaka, Japan) and Naoko Taninaka (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a resin composition capable of being turned into a cured product having a high glass-transition temperature and excellent dielectric properties as well. The resin composition is a heat-curable bismaleimide resin composition containing: (A) a bismaleimide compound represented by the following formula (1) wherein A independently represents a tetravalent organic ...