US Patent Issued to SHIN-ETSU CHEMICAL on March 24 for "Composition for forming protective film against alkaline aqueous hydrogen peroxide, substrate for producing semiconductor apparatus, method for forming protective film, and method for forming pattern" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,474, issued on March 24, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Composition for forming protective film against alkaline aqueous hydrogen peroxide, substrate for producing semiconductor apparatus, method for forming protective film, and method for forming pattern" was invented by Keisuke Niida (Joetsu, Japan), Takashi Sawamura (Joetsu, Japan), Daisuke Kori (Joetsu, Japan) and Seiichiro Tachibana (Joetsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composition for forming a protective film using a polymer having an imide group: cured under a film-forming condition in air and an inert gas; forming a protective film having ex...