US Patent Issued to SHIN-ETSU CHEMICAL on July 7 for "Composite substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,676,589, issued on July 7, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Composite substrate" was invented by Shoji Akiyama (Gunma, Japan), Shozo Shirai (Gunma, Japan) and Masayuki Tanno (Gunma, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite substrate that is obtained by bonding a silicon (Si) wafer having an interstitial oxygen concentration of 2 to 10 ppma to a piezoelectric material substrate as a support substrate, and thinning the piezoelectric material substrate after the bonding."

The patent was filed on Sept. 20, 2023, under Application No. 18/370,612.

*For further information, including images, charts and tables, plea...