US Patent Issued to SHIN-ETSU CHEMICAL on Dec. 16 for "Material for forming adhesive film, method for forming adhesive film using the same, and patterning process using material for forming adhesive film" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,639, issued on Dec. 16, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Material for forming adhesive film, method for forming adhesive film using the same, and patterning process using material for forming adhesive film" was invented by Takayoshi Nakahara (Joetsu, Japan), Yusuke Biyajima (Joetsu, Japan), Yuji Harada (Joetsu, Japan) and Tsutomu Ogihara (Joetsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a material for forming an adhesive film formed between a silicon-containing middle layer film and a resist upper layer film, the material for forming an adhesive film containing: (A) a resin having a structura...