ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,699,322, issued on Aug. 4, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Photosensitive resin composition, photosensitive dry film, layered product, and pattern formation method" was invented by Kumiko Hayashi (Annaka, Japan) and Kyoko Soga (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The coating formed from the photosensitive resin composition has excellent resolution and improved microprocessing properties, as well as satisfactory reliability in terms of adhesion and crack resistance, resolution, and flexibility. The photosensitive resin composition includes (A) a polymer including a silicone skeleton and (B) photo-acid generat...