ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,420, issued on March 17, was assigned to SHIN-ETSU CHEMICAL Co. LTD (Tokyo) and KOCHI PREFECTURAL PUBLIC UNIVERSITY Corp. (Kochi, Japan).

"Atomizing apparatus for film formation and film forming apparatus using the same" was invented by Hiroshi Hashigami (Annaka, Japan) and Toshiyuki Kawaharamura (Nankoku, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An atomizing apparatus for film formation enabling high-quality thin film formation with suppressed particle adhesion, including: a raw-material container accommodating a raw-material solution; a cylindrical member connecting inside the raw-material container to an outer unit, and disposed so a...