ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,719,023, issued on Aug. 25, was assigned to Shibaura Machine Co. Ltd. (Tokyo).

"Surface treatment apparatus" was invented by Rintaro Sueki (Numazu, Japan), Kazuhiro Fukada (Sunto-gun, Japan) and Takeshi Namba (Numazu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface treatment apparatus (10) performs film formation on a surface of a workpiece (W) in a chamber (20), and includes: an HCD electrode (210) (electrode) that supplies reaction gas to the workpiece (W) or a sputtering electrode (220) (electrode) that releases target particles to the workpiece (W), the HCD electrode (210) or the sputtering electrode (220) being placed facing the work...