US Patent Issued to Shenzhen Newsonic Technologies on Oct. 20 for "Surface acoustic wave filter wafer-level packaging structure and method" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,771,312, issued on Oct. 20, was assigned to Shenzhen Newsonic Technologies Co. Ltd. (Shenzhen, China).

"Surface acoustic wave filter wafer-level packaging structure and method" was invented by Guojun Weng (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface acoustic wave (SAW) filter includes a filter wafer including: a first substrate; and an interdigital transducer (IDT) disposed on the first substrate, the IDT including a first input and output end, a second input and output end, and an interdigital portion. The SAW filter also includes a dielectric layer disposed on the filter wafer, covering the first input and output end and t...