US Patent Issued to Shenzhen Newsonic Technologies on June 23 for "Bulk acoustic wave resonator with metal bonding layer" (Chinese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,665,567, issued on June 23, was assigned to Shenzhen Newsonic Technologies Co. Ltd. (Shenzhen, China).

"Bulk acoustic wave resonator with metal bonding layer" was invented by Guojun Weng (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bulk acoustic wave (BAW) resonator includes: a substrate; a piezoelectric layer disposed above the substrate; a first electrode disposed below the piezoelectric layer; a second electrode disposed above the piezoelectric layer; a first dielectric layer disposed below the piezoelectric layer; a second dielectric layer disposed below the first dielectric layer; a cavity disposed below the first electrode; a ...