US Patent Issued to SHENZHEN MICROBT ELECTRONICS TECHNOLOGY on Feb. 3 for "Heat sink, heat dissipation unit, and server" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,258, issued on Feb. 3, was assigned to SHENZHEN MICROBT ELECTRONICS TECHNOLOGY Co. LTD. (Guangdong, China).

"Heat sink, heat dissipation unit, and server" was invented by Yuefeng Wu (Guangdong, China), Haifeng Guo (Guangdong, China), Shilei Yuan (Guangdong, China) and Fangyu Liu (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this application disclose a heat sink, a heat dissipation unit, and a server. A first surface of the heat sink is provided with a heat dissipation fin, and a second surface of the heat sink is configured to dock with a circuit board. A heating element, such as a chip, is arranged on the circuit bo...