ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,448, issued on June 30, was assigned to SHENZHEN GEESUN INTELLIGENT TECHNOLOGY Co. LTD. (Guangdong, China).
"High-speed cutting device" was invented by Panpan Li (Guangdong, China), Wenwu Pang (Guangdong, China), Shunnan Cao (Guangdong, China), Xueke Wu (Guangdong, China) and Rukun Yang (Guangdong, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A high-speed cutting device includes a mounting frame, a feeding mechanism, a linear chasing-cutting mechanism, an electrode guide plate, and an acceleration driving mechanism, the acceleration driving mechanism is provided on the discharging side of the electrode guide plate, and configured to perform ...