US Patent Issued to Shenzhen Dancing Future Technology on July 21 for "Production process of flexible printed circuit encapsulation structure and flexible printed circuit encapsulation structure" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,145, issued on July 21, was assigned to Shenzhen Dancing Future Technology Ltd. (Shenzhen, China).

"Production process of flexible printed circuit encapsulation structure and flexible printed circuit encapsulation structure" was invented by Jianhui Huang (Shenzhen, China), Zhenlong Xie (Shenzhen, China) and Shuisong Liu (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a production process of a flexible printed circuit encapsulation structure, includes: a FPC overmolding step: processing the FPC board body and the FPC molding tape into an integrated structure to make the FPC board body and the FPC moldin...