ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,773,071, issued on Oct. 27, was assigned to ShenZhen Beibei Intelligent Co. LTD (Shenzhen, China) and Shenzhen Zhaode Wisdom Technology Co. Ltd. (Shenzhen, China).
"Heatable scoop" was invented by Tinglei Wang (Shenzhen, China), Shibin Lei (Shenzhen, China), Suyan Bai (Shenzhen, China) and Yujun Zhou (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heatable scoop is provided. The heatable scoop includes: a handle, a spoon and a heating device; the spoon is connected to one end of the handle; and the heating device is disposed between the handle and the spoon; and the heating device includes a heating pad, a circuit board, a switch touch...