US Patent Issued to SHANGHAI UNITED IMAGING MICROELECTRONICS TECHNOLOGY on Feb. 17 for "Devices and methods for testing of through silicon vias" (Chinese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,938, issued on Feb. 17, was assigned to SHANGHAI UNITED IMAGING MICROELECTRONICS TECHNOLOGY Co. LTD. (Shanghai).

"Devices and methods for testing of through silicon vias" was invented by Changzhi Shi (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a device, comprising: a substrate being provided with a through silicon via; at least one test assembly, each of the at least one test assembly including a surrounding structure, the surrounding structure being arranged around the through silicon via."

The patent was filed on June 27, 2023, under Application No. 18/342,724.

*For further information, including imag...