US Patent Issued to Shanghai Tianma Microelectronics on Oct. 14 for "Bendable film structure and manufacturing method thereof, display panel, and display device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,237, issued on Oct. 14, was assigned to Shanghai Tianma Microelectronics Co. Ltd. (Shanghai).

"Bendable film structure and manufacturing method thereof, display panel, and display device" was invented by Chuanfu Xiao (Shanghai) and Jian Jin (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a bendable film structure and a manufacturing method thereof, a display panel, and a display device. The bendable film structure includes at least one bendable region, a flexible substrate, and a filler layer. In the at least one bendable region, a first side of the flexible substrate includes multiple first recesses, and the filler layer inclu...