US Patent Issued to Shanghai Tianma Microelectronics on Dec. 16 for "Organic compound, hole injection material, and application thereof" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,400, issued on Dec. 16, was assigned to Shanghai Tianma Microelectronics Co. Ltd. (Shanghai).

"Organic compound, hole injection material, and application thereof" was invented by Yafei Lin (Shanghai), Jinghua Niu (Shanghai), Wanming Hua (Shanghai) and Jianyun Wang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are an organic compound, a hole injection material, and an application thereof. The organic compound has a structure as shown in Formula I or Formula II, and has a deep LUMO energy level through the mutual synergy of nuclear structures and substituents, and the LUMO energy level is close to the anode work function and the HO...