US Patent Issued to Shanghai Tianma Micro-electronics on July 14 for "Display module including a composite heat dissipation layer with crack relief openings and display device" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,003, issued on July 14, was assigned to Shanghai Tianma Micro-electronics Co. Ltd. (Shanghai).

"Display module including a composite heat dissipation layer with crack relief openings and display device" was invented by Kaikai Zhang (Shanghai) and Yongxin He (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A display module and a display device are provided. The display module includes a display panel and a composite layer. The composite layer is located on a backlight side of the display panel and includes a heat dissipation layer. The display panel includes a planar region, curved regions and corner regions. The curved regions are partially ...