US Patent Issued to SHANGHAI TIANMA MICRO-ELECTRONICS on Feb. 3 for "Multi-layered board, semiconductor package, and method of manufacturing semiconductor package" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,587, issued on Feb. 3, was assigned to SHANGHAI TIANMA MICRO-ELECTRONICS Co. LTD. (Shanghai).

"Multi-layered board, semiconductor package, and method of manufacturing semiconductor package" was invented by Akira Fujita (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layered board includes an upper insulating layer, a lower conductive layer including first lower conductive parts, an upper conductive layer between the lower conductive layer and the upper insulating layer and including first upper conductive parts and second upper conductive parts, and a lower insulating layer between the lower conductive layer and the upper cond...