US Patent Issued to SHANGHAI SILVER PASTE SCI. & TECH. on May 12 for "Conductive silver aluminum paste, method for preparing the same, and electrode using the same" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,835, issued on May 12, was assigned to SHANGHAI SILVER PASTE SCI. & TECH. Co. LTD. (Shanghai City, China).

"Conductive silver aluminum paste, method for preparing the same, and electrode using the same" was invented by Xiaolong Chen (Shanghai City, China), Jie Liu (Shanghai City, China), Can Ma (Shanghai City, China), Li Zhang (Shanghai City, China), Hongxia Ran (Shanghai City, China), Bing Liu (Shanghai City, China), Tian Yue (Shanghai City, China) and Xiang Wang (Shanghai City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses a conductive silver aluminum paste, a preparation method, an electrode, and an N-type To...